Author:
Bontzios Yiorgos I.,Dimopoulos Michael G.,Hatzopoulos Alkis A.
Subject
Hardware and Architecture,Modeling and Simulation,Software
Reference27 articles.
1. S.M. Musa, M.N.O. Sadiku, Application of the finite element method in calculating the capacitance and inductance of multiconductor transmission lines, in: IEEE SoutheastCon 08 Huntsville, Alabama, 2008, pp. 300–306.
2. A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections—BFEM;Hou;IEEE Trans. Electron Dev.,1998
3. W.C. Chew, L.J. Jiang, The General Variational Formulas for Capacitance Parameter Extraction, in: 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, 2005.
4. A simple formula for the estimation of the capacitance of two-dimensional interconnects in VLSI circuits;Yuan;IEEE Electron Dev. Lett.,1982
5. Modeling of interconnect capacitance, delay, and crosstalk in VLSI;Wong;IEEE Trans. Semiconduct. Manuf.,2000
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