Numerical simulation of corrosion process with two-step charge transfer mechanism in the Cu/CuSO4+H2SO4 system
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference16 articles.
1. Stability Constants. P.II. Inorganic Ligands/ Compiled by J. Bjerrum. London, 1958.
2. Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system
3. Electrochemical behavior of cuprous ion in a noncomplexing aqueous medium
4. A ring-disk electrode study of the electrochemical reduction of copper(II) in 0.2M sulfuric acid on platinum
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