Ultrafast thermal plasma physical vapor deposition of thick SiC films-Reference-Cited by-同舟云学术

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Ultrafast thermal plasma physical vapor deposition of thick SiC films

Published:2003-01 Issue:2 Volume:4 Page:159-165
ISSN:1468-6996
Container-title:Science and Technology of Advanced Materials
language:en
Short-container-title:Science and Technology of Advanced Materials

Author:

Wang X.H.¹,Eguchi K.¹,Iwamoto C.²,>Yoshida T.¹

Affiliation:

1. Department of Materials Engineering, Graduate School of EngineeringThe University of Tokyo,7-3-1 Hongo,Bunkyo-Ku 113-8656>SaitamaTokyo

2. Engineering Research Institute,yGraduate School of EngineeringThe University of Tokyo,22-11-16 Yayoi,Bunkyo-Ku113-8656>SaitamaTokyo

Publisher

Informa UK Limited

Subject

General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1016/S1468-6996%2803%2900016-0

Reference15 articles.

1. SiC MEMS: opportunities and challenges for applications in harsh environments

2. Advances in SiC materials and devices: an industrial point of view

3. In Situ Regeneration of Fusion Reactor First Walls

4. Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

5. SiC material for high-power applications

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1. Progress in SiC nanowire field-effect-transistors for integrated circuits and sensing applications;Microelectronic Engineering;2022-02

2. Synthesis of ultrafine silicon carbide nanoparticles using nonthermal arc plasma at atmospheric pressure;Journal of the American Ceramic Society;2021-04-24

3. Heat transfer and fouling deposition investigation on the titanium coated heat exchanger surface;Powder Technology;2020-08

4. Fabrication of porous silicon filled Pd/SiC nanocauliflower thin films for high performance H2 gas sensor;Sensors and Actuators B: Chemical;2018-07

5. Powders: Plasma Spray PVD for High-Throughput Production;Encyclopedia of Plasma Technology;2016-12-12

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