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Preparation of ultra fine nickel–copper bimetallic powder for BME-MLCC

  • Published:2007-01 Issue:1 Volume:38 Page:41-46
  • ISSN:0026-2692
  • Container-title:Microelectronics Journal
  • language:en
  • Short-container-title:Microelectronics Journal

Author:

Songping Wu

Publisher

Elsevier BV

Subject

General Engineering

Reference16 articles.

1. Preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in MLCI;Wu;Mater. Chem. Phys.,2004

2. Firing and processing effects on microstructure of fritted silver thick film electrode materials for solar cells;Rane;Mater. Chem. Phys.,2003

3. Preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in MLCI;Wu;Mater. Chem. Phys.,2005

4. H.T. Nagaokakyo, N.O. Moriyama, USP5850047.

5. Preparation of ultrafine copper powder with chemical reduction method;Wu;Mater. Lett.,2006
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