A comparative study on a high aspect ratio contact hole etching in UFC- and PFC-containing plasmas
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference10 articles.
1. Characterization of dielectric etching processes by X-ray photoelectron spectroscopy analyses in high aspect ratio contact holes;Joubert;Jpn. J. Appl. Phys.,1999
2. Vertical profile control in ultrahigh-aspect ratio contact hole etching with 0.05μmdiameter range;Ikegami;Jpn. J. Appl. Phys.,1998
3. Evaluation of C4F8O as an alternative plasma-enhanced chemical vapor deposition chamber clean chemistry;Pruette;J. Electrochem. Soc.,2000
4. Evaluation of oxalyl fluoride for a dielectric etch application in an inductively coupled plasma etch tool;Karecki;J. Electrochem. Soc.,2001
5. The use of unsaturated fluorocarbons for dielectric etch applications;Chatterjee;J. Electrochem. Soc.,2002
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Adsorption and Recovery using Vaporization of Liquid Fluorocarbon Precursor;Korean Journal of Metals and Materials;2020-06-05
2. Reduction of Greenhouse Gas Emissions by Metal Interconnect Etch Process Optimization;ECS Transactions;2012-05-04
3. A novel inspection method for the contact/via-holes in the multi-layer ULSI devices using the low-energy electron beam;Journal of the Korean Physical Society;2009-11-14
4. Inspection method for contact/via-holes using a low-energy electron microcolumn;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2009
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3