Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference16 articles.
1. Micro-opto-mechanical devices fabricated by anisotropic etching of (110) silicon;Uenishi;Micro Electro Mechanical Systems, Proceedings, IEEE,1994
2. Three-dimensional silicon electrostatic linear microactuator;Tirole;Sensors Actuators A,1995
3. Fabrication of reflective micromirror in micromechanical optical switches;Dong;Proc. SPIE,2002
4. Fabrication of very smooth walls and bottoms of silicon microchannels for heat dissipation of semiconductor devices;Dwivedi;Microelectron. J.,2000
5. Aqueous KOH etching of silicon (110) etch characteristics and compensation methods for convex corners;Kim;J. Electrochem. Soc.,1998
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2. Fluctuations During Anisotropic Etching: Local Recalibration and Application to Si{110};Journal of Microelectromechanical Systems;2016-08
3. A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching;Micro and Nano Systems Letters;2015-05-27
4. Anisotropic etching on Si{1 1 0}: experiment and simulation for the formation of microstructures with convex corners;Journal of Micromechanics and Microengineering;2014-10-29
5. A simple and robust model to explain convex corner undercutting in wet bulk micromachining;Micro and Nano Systems Letters;2013
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