Thermal analysis of high power LED package with heat pipe heat sink-Reference-Cited by-同舟云学术

Thermal analysis of high power LED package with heat pipe heat sink

Published:2011-11 Issue:11 Volume:42 Page:1257-1262
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Lu Xiang-you,Hua Tse-Chao,Wang Yan-ping

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. Thermal design of high-power LED package and system;Shin;Proc. SPIE,2006

2. Thermal analysis of high power GaN-based LEDs with ceramic package;Yang;Thermochim. Acta,2007

3. M. Arik, J. Prtroski, S. Weaver, Thermal challenges in the future generation solid state lighting applications: light emitting diodes, in: Proceedings of the ASME/1EEE International Packaging Technical Conference, Hawaii, 2001.

4. Chip scale thermal management of high brightness LED packages;Arik;Proc. SPIE,2004

5. A method for projecting useful life of LED lighting systems;Hong;Proc. SPIE,2004

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