Author:
Vishnyakov Victoria,Friedman Eby G.,Kolodny Avinoam
Reference18 articles.
1. Analytic CAD models for the signal transients and crosstalk noise of inductance-effect-prominent multicoupled RLC interconnect lines;Kim;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2008
2. An RLC interconnect model based on Fourier analysis;Chen;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2005
3. Analytical model for crosstalk and intersymbol interference in point-to-point buses;Tuuna;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2006
4. Compact physical models for multilevel interconnect crosstalk in gigascale integration (GSI);Naeemi;IEEE Trans. Electron Dev.,2004
5. S.H. Choi, B.C. Paul, K. Roy, Dynamic noise analysis with capacitive and inductive coupling, in: Proceedings of the IEEE Asia and South Pacific Design Automation Conference, January 2002, pp. 65–70.
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