Author:
Yang Bing,Li Dongbo,Yang Haiying,Hu Yongle,Yang Ping
Funder
National Natural Science Foundation of China
Jiangsu Province
Priority Academic Program Development of Jiangsu Higher Education Institutions
Reference16 articles.
1. CSP packaging and mounting technologies for mobile apparatus;Kimura;Proc. SPIE,1997
2. A study on package stacking process for package-on-package (POP);Yoshida;Electron. Compon. Technol. Conf., 2006. Proc. 56th. IEEE,2006
3. The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies;Karppinen;IEEE Trans. Device Mater. Reliab.,2013
4. Fatigue analysis on thermal characteristics for PBGA by using finite element method;Yang;J. Therm. Stress.,2014
5. A rapid life-prediction approach for PBGA solder joints under combined thermal cycling and vibration loading conditions;Qi;IEEE Trans. Compon. Packag. Technol.,2009
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献