Author:
Ali Karim,Yahya Eslam,Elrouby Alaa,Ismail Yehea
Funder
Zewail City of Science and Technology
AUC
STDF
Intel
Mentor Graphics
ITIDA
SRC
ASRT
MCIT
Reference35 articles.
1. D. Choudhury, 3D integration technologies for emerging microsystems, In: Proceedings of Microwave Symposium Digest, IEEE MTT-S International, 2010, pp. 1–4.
2. Introduction to System on Package;Tummala,2008
3. Chunghyun Ryu, Joungho Kim Jun So Pak, Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation, In: Electronic Materials and Packaging, EMAP, 2007, pp. 1–6.
4. G. Druais et al., TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration, In: Proceedings of the 3rd Electronic System-Integration Technology Conference (ESTC), 2010, pp. 1–4.
5. Li Jun-hui, Han Lei, and Zhong Jue, Characteristic comparing between thermosonic flip chip bonding and reflow flip chip, In: Proceedings of International Symposium on High Density packaging and Microsystem Integration, HDP׳07, 2007, pp. 1–3.
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