Heterogeneous 3-D circuits: Integrating free-space optics with CMOS
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Published:2016-04
Issue:
Volume:50
Page:66-75
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ISSN:0026-2692
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Container-title:Microelectronics Journal
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language:en
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Short-container-title:Microelectronics Journal
Author:
Savidis IoannisORCID, Ciftcioglu Berkehan, Xu Jie, Hu Jianyun, Jain Manish, Berman Rebecca, Xue Jing, Liu Peng, Moore Duncan, Wicks Gary, Huang Michael, Wu Hui, Friedman Eby G.
Subject
General Engineering
Reference39 articles.
1. J.-Q.Lu, 3-D Hyperintegration and packaging technologies for micro-nano systems, Proceedings of the IEEE, vol. 97, No. 1, January 2009, pp. 18–30. 2. Three-dimensional hybrid integration technology of cmos, mems, and photonics circuits for optoelectronic heterogeneous integrated systems;Lee;IEEE Trans. Electron Devices,2011 3. Three-dimensional photodetectors in 3-d silicon-on-insulator technology;Culurciello;IEEE Electron Device Lett.,2007 4. Future system-on-silicon LSI chips;Koyanagi;IEEE Micro,1998 5. N. McArdle, M. Naruse, H. Toyoda, Y. Kobayashi, M. Ishikawa, Reconfigurable optical interconnections for parallel computing, Proceedings of the IEEE, vol. 88, No. 6, June 2000, pp. 829–837.
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