Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN-Reference-Cited by-同舟云学术

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Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN

Published:2024-05 Issue: Volume:147 Page:106186
ISSN:1879-2391
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Gao Wen-Bin,Lin Xuan,Li Guo-Sheng,Yin Hong-Shun,Lv Fei-Long,Zhang Peng,Wang Da-Wei,Qian Wen-Sheng,Zhang Hao,Zhao Wen-Sheng^ORCID

Funder

National Natural Science Foundation of China

Zhejiang Province Natural Science Foundation

Publisher

Elsevier BV

Reference33 articles.

1. Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling;Guan;Microelectron. J.,2023

2. An efficient crosstalk-included eye-diagram estimation method for high-speed interposer channel on 2.5-D and 3-D IC;Choi;IEEE Trans. Electromagn C.,2017

3. Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs;Cho;IEEE Trans. Compon. Packag. Manuf. Technol.,2019

4. Circuit modeling and performance analysis of GNR@SWCNT bundle interconnects;Zhao;Chin. J. Electron.,2023

5. High-speed channel modeling with deep neural network for signal integrity analysis;Lu,2017

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition;Micromachines;2024-05-11

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