1. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
3. Towards the Extension of TRIC for Thermo-Mechanical Analysis;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23
4. Compact Electro-Thermal Models for Integrated Systems;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23
5. Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources;Microelectronics Reliability;2018-08