The mechanism study of laser peeling of ultra-thin polyimide film from the transparent substrate

Author:

Hong JinhuaORCID,Cheng PengORCID,Guo Jinhong,Chen WeiORCID,Li Yulong,Liu Jizhong,Zhu QinmiaoORCID,Chen JiankuiORCID

Funder

Special Project for Research and Development in Key areas of Guangdong Province

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry

Reference30 articles.

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4. Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics;Kim;Nat. Mater.,2010

5. Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure;Liu;IEEE Trans. Compon. Packag. Manuf. Technol.,2018

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