Coupled seepage-elastoplastic-damage analysis of saturated porous media and its application to water conveyance tunnel
Author:
Publisher
Elsevier BV
Subject
Geotechnical Engineering and Engineering Geology,Building and Construction
Reference15 articles.
1. Study on coupled seepage and stress fields in the concrete lining of the underground pipe with high water pressure;Bian;Tunn. Undergr. Sp. Tech.,2009
2. The elastic coefficients of the theory of consolidation;Biot;ASME J. Appl. Mech.,1957
3. Softening in stress–strain curve for Drucker–Prager non-associated plasticity;Bousshine;Int. J. Plasticity,2001
4. On the formulation of anisotropic degradation. I. Theory based on a pseudo-logarithmic damage tensor;Carol;Int. J. Solids Struct.,2001
5. A micromechanical model for concrete in compression;Fanella;Eng. Fract. Mech.,1988
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