Pure-silica LTA, CHA, STT, ITW, and -SVR thin films and powders for low-k applications-Reference-Cited by-同舟云学术

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Pure-silica LTA, CHA, STT, ITW, and -SVR thin films and powders for low-k applications

Published:2010-05 Issue:1-3 Volume:130 Page:49-55
ISSN:1387-1811
Container-title:Microporous and Mesoporous Materials
language:en
Short-container-title:Microporous and Mesoporous Materials

Author:

Hunt Heather K.,Lew Christopher M.,Sun Minwei,Yan Yushan,Davis Mark E.

Publisher

Elsevier BV

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,General Chemistry

Reference31 articles.

1. International Technology Roadmap for Semiconductors, 2007.

2. Low dielectric constant materials for microelectronics

3. Mechanical and Dielectric Properties of Pure-Silica-Zeolite Low-k Materials

4. Hydrofluoric-Acid-Resistant and Hydrophobic Pure-Silica-Zeolite MEL Low-Dielectric-Constant Films

5. Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

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4. Micro-Analytical Study of a Zeolites/Geo-Polymers/Quartz Composite, Dielectric Behaviour and Contribution to Brønsted Sites Affinity;Ceramics;2022-11-02

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