Characterization of condensed plasmid DNA models for studying the direct effect of ionizing radiation
Author:
Publisher
Elsevier BV
Subject
Organic Chemistry,Biochemistry,Biophysics
Reference53 articles.
1. DNA condensation;Bloomfield;Curr. Opin. Struct. Biol.,1996
2. Cation induced toroidal condensation of DNA: studies with Co3+(NH3)6;Widom;J. Mol. Biol.,1980
3. DNA condensation by polyamines: a laser light scattering study of structural effects;Vijayanathan;Biochemistry,2001
4. Biophysical characterization of the DNA binding and condensing properties of adenoviral peptide mu;Keller;Biochemistry,2002
5. The antifungal protein AFP of Aspergillus giganteus is an oligonucleotide/oligosaccharide binding (OB) fold containing protein that produces condensation of DNA;del Pozo;J. Biol. Chem.,2002
Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Size exclusion chromatography of biopharmaceutical products: From current practices for proteins to emerging trends for viral vectors, nucleic acids and lipid nanoparticles;Journal of Chromatography A;2024-05
2. DNA Packaging and Polycation Length Determine DNA Susceptibility to Free Radical Damage in Condensed DNA;The Journal of Physical Chemistry B;2024-04-01
3. DNA condensation by cysteine containing tetra-arginine ligands as a model for ionizing radiation damage to chromatin;Radiation Physics and Chemistry;2023-12
4. Genome editing and cancer therapy: handling the hypoxia-responsive pathway as a promising strategy;Cellular and Molecular Life Sciences;2023-07-21
5. Hierarchical Self-Assembly Route to “Polyplex-in-Hydrophobic-Core” Micelles for Gene Delivery;Chemistry of Materials;2021-08-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3