On the significance of grain junction topology and crystallography in polycrystals
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference11 articles.
1. Mechanism of steady-state grain growth in aluminum
2. Measurement of grain boundary geometry in cubic polycrystals;Randle,1993
3. V. Randle and G. Palumbo, submitted to Acta Met. Mat.
4. Triple-line corrosion in high purity nickel
5. Description of orientation coherence in polycrystalline materials
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2. The Parameters and Fundamental Zones of Twin-Dependent Triple Junction Distributions;Metallurgical and Materials Transactions A;2015-02-18
3. Combination rule for deviant CSL grain boundaries at triple junctions;Acta Materialia;2003-08
4. An analysis for contribution of triple-line diffusion to low-temperature creep of very fine-grained materials;Scripta Materialia;1999-12
5. Triple junction and grain boundary character distributions in metallic materials;Acta Materialia;1997-08
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