Kinetics of wetting Ag substrates by 60Sn40Pb-Reference-Cited by-同舟云学术

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Kinetics of wetting Ag substrates by 60Sn40Pb

Published:1994-03 Issue:6 Volume:30 Page:725-730
ISSN:0956-716X
Container-title:Scripta Metallurgica et Materialia
language:en
Short-container-title:Scripta Metallurgica et Materialia

Author:

Wang Xiao Hong,Conrad Hans

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Materials Developments in Microelectronic Packaging; Performance and Reliability;Chen,1991

2. Surface Mount Technology Conf.;Chen,1992

3. The spreading of silicone oil drops on horizontal surfaces

4. Wetting: statics and dynamics

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface;Journal of Electronic Materials;2008-11-06

2. A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates;Journal of Electronic Materials;2008-06-27

3. Spreading of mercury droplets on thin silver films at room temperature;Physical Review E;2007-05-02

4. Effects upon interfacial reactions by electric currents of reversing directions;Materials Chemistry and Physics;2003-12

5. Microstructures in solder joints between Sn95.5Ag4Cu0.5 solder and Ag/Pd thick film;Journal of Electronic Materials;2003-03

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