Thermal sensation and thermal comfort in changing environments
Author:
Funder
VDL
Heavac
TNO
Publisher
Elsevier BV
Subject
Mechanics of Materials,Safety, Risk, Reliability and Quality,Building and Construction,Architecture,Civil and Structural Engineering
Reference24 articles.
1. Thermal sensation and comfort in transient non-uniform thermal environments;Zhang;Eur. J. Appl Physiol.,2004
2. Thermal sensations and comfort investigations in transient conditions in tropical office;Dahlan;Appl Ergon.,2016
3. The response of human thermal sensation and its prediction to temperature step-change (cool-neutral-cool);Du;PLoS One,2014
4. The response of human thermal perception and skin temperature to step-change transient thermal environments;Liu;Build. Environ.,2014
5. Investigation of subjectively assessed health symptoms and human thermal perceptions in transient thermal environments;Xiong;Procedia Eng.,2015
Cited by 67 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mature but nascent − A scoping review for wearable thermoregulating devices;Energy and Buildings;2024-09
2. AutoTherm: A Dataset and Benchmark for Thermal Comfort Estimation Indoors and in Vehicles;Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies;2024-08-22
3. Study on the relationship between EEG and salivary IgE under step-change temperature environments;Indoor and Built Environment;2024-07-30
4. Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect;Building Simulation;2024-07-04
5. A review of investigation of the metabolic rate effects on human thermal comfort;Energy and Buildings;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3