Author:
Li Taotao,Dang Ning,Liang Miaomiao,Guo Chunli,Lu Huihu,Ma Jingyu,Liang Wei
Funder
Natural Science Foundation of China
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference27 articles.
1. C.E. Tan, Y.J. Pan, T.K. Cheok, Copper wire bonding — Elimination of pad peel, in: Electronics Packaging Technology Conference, 2017, pp. 129–134.
2. Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires;Kim;Mech. Mater.,2006
3. A. Hensel, M. Mueller, J. Franke, K.K.V. Platen, Additive copper metallization of semiconductors for enabling a copper wire bonding process, in: International Spring Seminar on Electronics Technology, 2017, pp. 1–6.
4. Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer;Zhang;Int. J. Adv. Manuf. Technol.,2017
5. Investigation of recrystallization and grain growth of copper and gold bonding wires;Cho;Metall. Mater. Trans. A,2006
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