Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
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1. Initiation of electroless Cu plating on nonmetallic surfaces
2. Electroless Plating: Fundamentals and Applications;Mallor,1990
3. J.Z. Rudolph, F.M. John, D.W. John, S. Frederick Jr., Electroless Copper Plating. United States Patent 3,095,309 (1963).
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