Author:
Balaraju J.N.,Anandan C.,Rajam K.S.
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference16 articles.
1. Electroless Plating: Fundamentals and Applications;Mallory,1990
2. M. Gulla, US Patent 3,764,352 (1973).
3. L.L. Zhong, C.C. Liu, J.D. St. John, US Patent 6,410,104 (2002).
4. NiCuP and NiCoP as a diffusion barrier between an Al pad and a solder bump
5. Wetting interactions between the Ni-Cu-P deposit and In-Sn solders
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献