Influence of mold and substrate material combinations on nanoimprint lithography process: MD simulation approach-Reference-Cited by-同舟云学术

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Influence of mold and substrate material combinations on nanoimprint lithography process: MD simulation approach

Published:2014-05 Issue: Volume:301 Page:189-198
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Yang Seunghwa,Yu Suyoung,Cho Maenghyo

Funder

National Research Foundation of Korea (NRF)

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference38 articles.

1. Imprint of sub-25nm vias and trenches in polymers;Chou;Appl. Phys. Lett.,1995

2. Nanoimprint lithography;Chou;J. Vac. Sci. Technol B,1996

3. Sub-10nm imprint lithography and applications;Chou;J. Vac. Sci. Technol. B,1997

4. Imprint lithography with sub-10nm fearue size and high throughput;Chou;Microelectron. Eng.,1997

5. Defect analysis in thermal nanoimprint lithography;Hirai;J. Vac. Sci. Technol. B,2003

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