1. Structural Changes in a Resist Resulting from Plasma Exposure during the Reactive Ion Etching Process
2. E. Kesters, M. Claes, Q.T. Le, M. Lux, A. Franquet, G. Vereecke, P.W. Mertens, M.M. Frank, R. Carleer, P. Adriaensens, J.J. Biebuyk, S. Bebelman, in: Proceedings of DPS2006, 28th International Symposium on Dry Process, Nagoya, Japan, 2006, to be published.
3. G. Zschätzsch, Development of a XPS metrology to analyze the sidewalls of etched trench structures, Master Thesis, Technische Universität Dresden, Germany, 2007.
4. Dry etching with gas chopping without rippled sidewalls