Effect of thiol adsorption on the electrical resistance of copper ultrathin films-Reference-Cited by-同舟云学术

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Effect of thiol adsorption on the electrical resistance of copper ultrathin films

Published:2024-11 Issue: Volume:673 Page:160912
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Gray Gabriel,Marín Francisca,del Campo Valeria,González-Fuentes Claudio,Correa-Puerta Jonathan,Flores Marcos,Segura Rodrigo,Häberle Patricio,Henríquez Ricardo

Funder

ANID

Law Offices of Anidjar and Levine, P.A.

Publisher

Elsevier BV

Reference67 articles.

1. Jeurgens. In situ oxidation studies of Cu thin films: growth kinetics and oxide phase evolution;Unutulmazsoy;J. Appl. Phys.,2020

2. The search for the most conductive metal for narrow interconnect lines;Gall;J. Appl. Phys.,2020

3. Epitaxial metals for interconnects beyond Cu;Barmak;J. Vac. Sci. Technol. A,2020

4. Electrical transport during growth, aging and oxidation of copper ultrathin films before percolation;Marín;Results Phys.,2020

5. Size effects and charge transport in metals: quantum theory of the resistivity of nanometric metallic structures arising from electron scattering by grain boundaries and by rough surfaces;Munoz;Appl. Phys. Rev.,2017

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