Physico-chemical characterization of polyimide passivation layers for high power electronics applications
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Published:2024-10
Issue:
Volume:670
Page:160719
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ISSN:0169-4332
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Container-title:Applied Surface Science
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language:en
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Short-container-title:Applied Surface Science
Author:
Spampinato ValentinaORCID,
Auditore AlessandroORCID,
Tuccitto NunzioORCID,
Vitale RobertaORCID,
Bellocchi GabrieleORCID,
Galliano Francesco,
Rascunà Simone,
Arena GiuseppeORCID,
Licciardello AntoninoORCID
Reference25 articles.
1. Silicon carbide benefits and advantages for power electronics circuits and systems;Elasser;Proceedings of the IEEE,2002
2. Material science and device physics in SiC technology for high-voltage power devices;Kimoto;Jpn. J. Appl. Phys.,2015
3. Investigations on high temperature polyimide potentialities for silicon carbide power device passivation;Zelmat;Microelectron. Eng.,2006
4. Polymers for Electronic and Photonic Applications,1993
5. Q.-H. Lu, F. Zheng, Chapter 5 - Polyimides for Electronic Applications in: Shi-Yong Yang (Ed.), Advanced Polyimide Materials, Elsevier, 2018, 195-255. https://doi.org/10.1016/B978-0-12-812640-0.00005-6.