1. W.M. Lee, Technical Report. EKC Technology Inc., 2000.
2. S.J. Kirk, T.T. Nguyen, in: Technical Proceedings, Singapore, 1995.
3. Ablation and cleaning of wafer surface by excimer laser
4. Y.P. Lee, Y.F. Lu, S.H.C. Daniel, J. Appl. Phys. 28 (1997) 2524.