Fabrication of periodical micro-stripe structure of polyimide by laser interference induced forward transfer technique-Reference-Cited by-同舟云学术

Fabrication of periodical micro-stripe structure of polyimide by laser interference induced forward transfer technique

Published:2021-03 Issue: Volume:541 Page:148466
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Shen Huijuan,Wang Yaode,Cao Liang,Xie Ying,Wang Ying,Zhang Qinhan,Zhang Wenxiao,Wang Shenzhi,Han Zhuang,Zhu Xiaona,Yu Miaomiao,Liu Ri,Gao Mingyan,Li Changli,Weng Zhankun,Wang Zuobin

Funder

Department of Science and Technology of Jilin Province

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference86 articles.

1. Laser direct-write techniques for printing of complex materials;Arnold;MRS Bull.,2007

2. Ultrafast laser processing of materials: from science to industry;Malinauskas;Light Sci. Appl.,2016

3. Direct writing technology-Advances and developments;Hon;CIRP Ann.,2008

4. 3D printing for the rapid prototyping of structural electronics;Macdonald;IEEE Access,2014

5. Integrating stereolithography and direct print technologies for 3D structural electronics fabrication;Lopes;Rapid Prototyping J.,2012

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser Interference Additive Manufacturing: Mask Bundle Shape Bionic Shark Skin Structure;ACS Applied Materials & Interfaces;2024-07-04

2. Laser interference photocuring curved surface grating lenses inspired by red spider’s eyes;Optics & Laser Technology;2024-04

3. A review on critical challenges in additive manufacturing via laser-induced forward transfer;Optics & Laser Technology;2024-01

4. 激光干涉诱导向前转移制备银微点及SERS特性研究;Chinese Journal of Lasers;2024

5. Microstructures Formation through Liquid‐Assisted Assembly of Functional Materials for High‐Performance Electronics;Advanced Functional Materials;2023-12-28