The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study-Reference-Cited by-同舟云学术

The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study

Published:2020-04 Issue: Volume:510 Page:145251
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Cui Zhen,Fan Jiajie^ORCID,van Ginkel Hendrik Joost,Fan Xuejun,Zhang Guoqi^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference34 articles.

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2. LED Packaging for Lighting Applications: Design, Manufacturing, and Testing;Liu,2011

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4. Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package;Pan;Polymers,2018

5. Phosphor–silicone interaction effects in high power white light emitting diode packages;Fan;J. Mater. Sci.: Mater. Electron.,2017

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