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Influence of atmospheric particulates on initial corrosion behavior of printed circuit board in pollution environments

  • Published:2019-02 Issue: Volume:467-468 Page:889-901
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Wang Jirui,Bai Ziheng,Xiao Kui,Gao Xiong,Yi Pan,Dong Chaofang,Wu Junsheng,Wei Dan

Funder

the National Natural Science Foundation of China

the National Basic Research Program of China

the National Environmental Corrosion Platform

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference49 articles.

1. Failure investigation on copper-plated blind vias in PCB;Ji;Microelectron. Reliab.,2010

2. Failure mechanism of solder bubbles in PCB vias during high-temperature assembly;Chen;Circuit World,2013

3. The corrosion behavior of PCB-ImAg in industry polluted marine atmosphere environment;Yan;Mater. Design.,2017

4. The development and performance characteristics of mixed flowing gas test environment;Abbott;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1987

5. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment;Zou;Electrochim. Acta,2013
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