Molecular dynamics study of interfacial bonding strength of self-assembled monolayer-coated Au-epoxy and Au

Molecular dynamics study of interfacial bonding strength of self-assembled monolayer-coated Au-epoxy and Au–Au systems

Published:2011-08 Issue:20 Volume:257 Page:8665-8674
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Cheng Hsien-Chie,Hsu Yu-Chen,Wu Chun-Hung,Chen Wen-Hwa

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference55 articles.

1. F.L. Wei, Ph.D. Dissertation, Department of Materials Science and Engineering, Massachusetts Institute of Technology, 2007.

2. T. Furusawa, N. Sakuma, D. Ryuzaki, S. Kondo, K.I. Takeda, S.T. Machida, K. Hinode, Proceedings of the IEEE 2000 International Interconnect Technology Conference, 2000, p. 222.

3. Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film

4. A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly

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