AlN films prepared on 6H–SiC substrates under various sputtering pressures by RF reactive magnetron sputtering-Reference-Cited by-同舟云学术

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AlN films prepared on 6H–SiC substrates under various sputtering pressures by RF reactive magnetron sputtering

Published:2012-12 Issue: Volume:263 Page:62-68
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kuang Xu-Ping,Zhang Hua-Yu,Wang Gui-Gen,Cui Lin,Zhu Can,Jin Lei,Sun Rui,Han Jie-Cai

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference36 articles.

1. Rapid process for manufacturing aluminum nitride powder;Weimer;Journal of the American Ceramic Society,1994

2. Facile solvent-free synthesis of pure-phased AlN nanowhiskers at a low temperature;Wu;Journal of Solid State Chemistry,2004

3. Ferroelectric thin films: review of materials, properties, and applications;Setter;Journal of Applied Physics,2006

4. Field emission properties of heavily Si-doped AlN in triode-type display structure;Taniyasu;Applied Physics Letters,2004

5. Nitride-based semiconductors for blue and green light-emitting devices;Ponce;Nature,1997

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1. Effects of sputtering pressure on microstructure and secondary electron emission properties of AlN film prepared by magnetron sputtering;Materials Letters;2024-12

2. Theoretical study on the hydrogen evolution performance of two-dimensional Z-scheme AlN/ReS2 heterojunction photocatalysts;International Journal of Hydrogen Energy;2024-09

3. Anti-corrosive yet color-tunable AlN/Si multilayer hard coatings on 304 stainless steel by magnetron sputtering;Ceramics International;2024-01

4. The evolution of preferred orientation and morphology of AlN films under various sputtering parameters;Journal of Crystal Growth;2024-01

5. Enhancement of hardness and corrosion resistance of Al-Si-N multilayer color coating via SiN/AlSiN/AlN compositional gradient interlayer;Journal of Vacuum Science & Technology A;2023-12-27

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