Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL

Author:

Zhou Guoyun,Li Wenbin,Xiang Qinying,He Wei,Wang Shouxu,Chen Yuanming,Hong Yan,Yang Wenjun,Lai Mingsheng,Chen Shijin,Xu Huan

Funder

Sail Plan Project of Guangdong, China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference20 articles.

1. A novel nitric acid etchant and its application in manufacturing fine lines for PCBs [J];Zhou;IEEE Trans. Electron. Packag. Manuf.,2010

2. Advantages and challenges of 10-Gbps transmission on high-density interconnect boards [J];Chang;J. Electron. Mater.,2016

3. CO2 laser induced blind-via for direct electroplating [J];Huang;Adv. Mater. Res.,2014

4. Copper direct drilling with TEA CO2 laser in manufacture of high-density interconnection printed circuit board [J];Fang;IEEE Trans. Electron. Packag. Manuf.,2006

5. Application of ultraviolet laser in high density interconection micro blind via [C];Long,2011

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