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Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP

  • Published:2015-10 Issue: Volume:353 Page:499-503
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Seo Jihoon,Moon Jinok,Moon Sunho,Paik Ungyu

Funder

National Research Foundation of Korea

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference31 articles.

1. Chemical–mechanical Planarization of Semiconductor Materials;Oliver,2004

2. Chemical–mechanical Planarization of Microelectronic Materials;Steigerwald,2008

3. Advances in chemical–mechanical planarization;Singh;MRS Bull.,2002

4. The effect of CeO2 abrasive size on dishing and step height reduction of silicon oxide film in STI-CMP;Lim;Surf. Coat. Tech.,2005

5. Control of adhesion force between ceria particles and polishing pad in shallow trench isolation chemical mechanical planarization;Seo;J. Nanosci. Nanotechnol.,2014
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