Interface characteristics comparison of sapphire direct and indirect wafer bonded structures by transmission electron microscopy-Reference-Cited by-同舟云学术

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Interface characteristics comparison of sapphire direct and indirect wafer bonded structures by transmission electron microscopy

Published:2019-11 Issue: Volume:494 Page:566-574
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Li Wangwang,Liang Ting,Liu Wenyi,Lei Cheng,Hong Yingping,Li Yongwei,Li Zhiqiang,Xiong Jijun

Funder

China National Funds for Distinguished Young Scholars

Shanxi ‘1331 Project’ Key Subject Construction

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference47 articles.

1. Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits;Fukushima;Appl. Phys. Lett.,2010

2. Interface characteristics of different bonded structures fabricated by low-temperature a-Ge wafer bonding and the application of wafer-bonded Ge/Si photoelectric device;Ke;J. Mater. Sci.,2019

3. High performance germanium photodetectors integrated on submicron silicon waveguides by low temperature wafer bonding;Chen;Opt. Express,2008

4. Low temperature direct bonding of InP and Si3N4-coated silicon wafers for photonic device integration;Wang;J. Electrochem. Soc.,2012

5. Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias;Kühne;J. Micromech. Microeng.,2011

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of Wet-Etched Structures on R-Plane Substrates of Sapphire in the Etchant of Sulfuric Acid and Phosphoric Acid;ECS Journal of Solid State Science and Technology;2024-04-01

2. Periodic Al₂O₃ Nanohole Arrays on MgO (100) for a Low-Reflectivity External Cavity Fabry–Pérot Interferometer;ACS Applied Nano Materials;2024-02-07

3. Indirect bonding of MgO wafers based on intercalation crystallisation of amorphous MgO film;Surfaces and Interfaces;2023-08

4. Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G;Micromachines;2021-08-11

5. Interface Characterization and Analysis of 4H-SiC Direct Bonding Structure Based on Plasma Processing;ECS Journal of Solid State Science and Technology;2021-03-01

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