Effect of cuprous ions on Cu leaching in the recycling of waste PCBs, using electro-generated chlorine in hydrochloric acid solution-Reference-Cited by-同舟云学术

Effect of cuprous ions on Cu leaching in the recycling of waste PCBs, using electro-generated chlorine in hydrochloric acid solution

Published:2008-01 Issue:1 Volume:21 Page:121-128
ISSN:0892-6875
Container-title:Minerals Engineering
language:en
Short-container-title:Minerals Engineering

Author:

Kim Eun-young,Kim Min-seuk,Lee Jae-chun,Jha Manis Kumar,Yoo Kyoungkeun,Jeong Jinki

Publisher

Elsevier BV

Subject

Mechanical Engineering,Geotechnical Engineering and Engineering Geology,General Chemistry,Control and Systems Engineering

Reference21 articles.

1. Electrolyte purification in energy-saving monovalent copper electrowinning processes;Alam;Hydrometallurgy,2007

2. Aue, A., Skjutare, L., Björling, G., Reinhardt, H., Rydberg, J., 1971. Separation of iron, cobalt and nickel from scrap alloy by a solvent extraction process. In: Proceedings of the Conference on ISEC 1971, ISEC, The Netherlands, pp. 447–450.

3. Solubility of chlorine in aqueous hydrochloric acid solutions;Alkan;J. Hazard. Mater.,2005

4. Handbook of Solvent Extraction;Baird,1983

5. Chloride hydrometallurgy for complex sulfides: a review;Flett;CIM Bull.,2002

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