1. On analytic model of multiple vias for high-speed printed circuit board and electric band-gap structures. Proceedings of the IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS'12), Oct 21–24, 2012, Tempe, AZ, USA;Zhang,2012
2. The radiation of a rectangular power-bus structure at multiple cavity-mode resonances;Leone;IEEE Transactions on Electromagnetic Compatibility,2003
3. Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB. Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (EMC'03): Vol 1, Aug 18–22, 2003, Istanbul, Turkey;Pak,2003
4. A closed-form expression for estimating radiated emissions from the power planes in a populated printed circuit board;Shim;IEEE Transactions on Electromagnetic Compatibility,2006