1. Wang L, Wong CP. Proceedings of the Third International Symposium on Electronic Packaging Technology, Beijing, China; 1998. p. 495.
2. Wada M. Proceedings of the 49th Electronic Components and Technology Conference (ECTC), San Diego, CA; 1999. p. 56.
3. Feustel F, Eckebracht A. Proceedings of the 49th Electronic Components and Technology Conference (ECTC), San Diego, CA; 1999. p. 583.
4. Epoxy resins;Lee,1988