Analysis of the kinetics and mechanism of the cure of a bismaleimide–diamine thermoset-Reference-Cited by-同舟云学术

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Analysis of the kinetics and mechanism of the cure of a bismaleimide–diamine thermoset

Published:2000-11 Issue:23 Volume:41 Page:8231-8239
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Hopewell J

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of Heat-Resistant Insulating Impregnating Varnish Based on Bismaleimide/Diamine Copolymer;Journal of Nanoelectronics and Optoelectronics;2023-08-01

2. High-performance thermosets for additive manufacturing;Innovation and Emerging Technologies;2023-01

3. An investigation on curing rheokinetics of a nadic end-capped MDA-BTDA-ODA copolyimide resin by dynamic mechanical analysis;Polymer Testing;2019-08

4. Cure-Reaction Kinetics of Crosslinked Polythiourethane Network for Optical Applications Using FTIR Spectroscopy;Polymer Science, Series B;2019-05

5. Cure kinetics of bismaleimides as basis for polyimide-like inks for PolyJet™-3D-printing;Journal of Applied Polymer Science;2018-11-11

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