Physical gelation in ethylene–propylene copolymer melts induced by polyhedral oligomeric silsesquioxane (POSS) molecules-Reference-Cited by-同舟云学术

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Physical gelation in ethylene–propylene copolymer melts induced by polyhedral oligomeric silsesquioxane (POSS) molecules

Published:2003-03 Issue:5 Volume:44 Page:1499-1506
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Fu Bruce X.,Gelfer Michael Y.,Hsiao Benjamin S.,Phillips Shawn,Viers Brent,Blanski Rusty,Ruth Patrick

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference25 articles.

1. Polyhedral Oligomeric Silsesquioxanes: Building Blocks for Silsesquioxane-Based Polymers and Hybrid Materials

2. Thermoplastic Hybrid Materials: Polyhedral Oligomeric Silsesquioxane (Poss) Reagents, Linear Polymers, and Blends

3. Hybrid Organic−Inorganic Thermoplastics: Styryl-Based Polyhedral Oligomeric Silsesquioxane Polymers

4. Structural development during deformation of polyurethane containing polyhedral oligomeric silsesquioxanes (POSS) molecules

5. Mechanical Relaxation and Microstructure of Poly(norbornyl-POSS) Copolymers

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1. Morphology, rheology, properties, and applications of polyhedral oligomeric silsesquioxanes-filled polymer blends;Nanofillers for Binary Polymer Blends;2024

2. Rheological percolation, gel‐like behavior and electrical conductivity of multi‐walled carbon nanotubes filled ethylene‐vinyl acetate copolymer/acrylonitrile‐butadiene rubber nanocomposites;Polymer Composites;2023-10-24

3. New Insights into the Structure, Properties, and Applications of Polyhedral Oligomeric Silsesquioxane;Silicon;2023-05-16

4. Rheological percolation, gel-like behavior and electrical conductivity of multi- walled carbon nanotubes filled ethylene-vinyl acetate copolymer/acrylonitrile- butadiene rubber nanocomposites;2023-03-30

5. Thermal conductivity and electromagnetic shielding performance of three-dimensional anisotropic BN/MWCNT epoxy composites under low filling capacity;Colloid and Polymer Science;2023-03-15

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