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2. Ultra high thermal conductance microstructures for cooling integrated circuits;Tuckerman;IEEE, ch. 781-4,1982
3. Thermal management in semiconductor device packaging;Mahalingam;Proc. IEEE,1985
4. Generalization of the Results on Heat Transfer Intensification in Channels with Porous Insertion (in Russian);Haritonov;Teplofizika Vys. Temp.,1994
5. Thermophysics of Cooled Laser Mirrors (in Russian);Subbojin;Teplofizika Vys. Temp.,1991