Residual stresses in structures reinforced with adhesively bonded straps designed to retard fatigue crack growth
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference43 articles.
1. Damage tolerance and fail safety of welded aircraft wing panels;Zhang;AIAA J,2005
2. Reinforcement of the F-111 wing pivot fitting with a boron⧹epoxy doubler system – materials engineering aspects;Baker;Composites,1993
3. Comparison of double and single bonded repairs to symmetric composite structures: a numerical analysis;Belhouari;Compos Struct,2004
4. Residual stress development during the composite patch bonding process: measurement and modelling;Djokic;Composites,2002
5. Analytical and experimental study of load attractions and fatigue crack growth in two-sided bonded repairs;Duong;Compos Struct,2006
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