A practical methodology for modeling and verification of self-healing microcapsules-based composites elasticity
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference21 articles.
1. Epoxy Resin Market Size & Share|Industry Report, 2024; 2016. doi:978-1-68038-171-9.
2. Epoxy adhesive formulations;Petrie,2005
3. The reinforcement role of carbon nanotubes in epoxy composites with different matrix stiffness;Ci;Compos Sci Technol,2006
4. Epoxy-silica particulate nanocomposites: chemical interactions, reinforcement and fracture toughness;Ragosta;Polymer (Guildf),2005
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigating the influence of self-healing microcapsule volume fraction on the dynamic mechanical properties and self-healing performance of epoxy-based composites;Journal of Polymer Research;2024-06-26
2. Interlaminar shear strength and self-healing of spread carbon fiber/woven carbon fiber hybrid reinforced epoxy resin laminates containing microcapsules;Mechanical Engineering Journal;2024
3. XFEM and machine learning combined approach for failure prediction of microcapsules in cement-based self-healing materials;Construction and Building Materials;2023-12
4. Evaluation of the viscoelastic behavior, thermal transitions, and self‐healing efficiency of microcapsules‐based composites with and without a catalyst using dynamic mechanical analysis technique;Journal of Applied Polymer Science;2023-06-27
5. A micromechanical damage-healing model for encapsulation-based self-healing polymer composites under tensile loading;Mechanics of Advanced Materials and Structures;2023-04-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3