A theoretical analysis of interface debonding for coated sphere with functionally graded interphase

Author:

Ben Sudong,Zhao Junhua,Rabczuk Timon

Publisher

Elsevier BV

Subject

Civil and Structural Engineering,Ceramics and Composites

Reference25 articles.

1. Kristiansen H. Electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive, PEP 99, Gothenburg, October; 1999. p. 63–71.

2. Kristiansen H, Grønlund TO, Liu J. Characterization of metal-coated polymer spheres and its use in anisotropic conductive adhesive. In: Proceedings of the 6th IEEE CPMT international symposium on high density packaging and component failure anlaysis (HDP’4). 04 (EX905) s, July 2004, Shanghai; 2004. p. 259-264 .

3. Anisotropically conductive adhesive flip–chip bonding on rigid and flexible printed circuit substrates;Lai;IEEE Trans Compon, Packag Manuf Technol, Part B,1996

4. Size effect on mechanical properties of micron-sized PS–DVB polymer particles;He;Polymer,2008

5. Loading and unloading of a spherical contact: from elastic to elastic–perfectly plastic materials;Zhao;Int J Mech Sci,2012

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