Multi-scale structural topology optimization of free-layer damping structures with damping composite materials
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference38 articles.
1. Length optimization of constrained viscoelastic layer damping;Plunkett;J Acoust Soc Am,1970
2. Damping analysis of partially covered sandwich beams;Lall;J Sound Vib,1988
3. Development of approximate methods for the analysis of patch damping design concepts;Kung;J Sound Vib,1999
4. Vibration control in machines and Structures using viscoelastic damping;Nakra;J Sound Vib,1998
5. Generating optimal topologies in structure design using homogenization method;Bendsøe;Comput Methods Appl Mech Eng,1988
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