Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids-Reference-Cited by-同舟云学术

Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids

Published:2018-06 Issue: Volume:193 Page:212-223
ISSN:0263-8223
Container-title:Composite Structures
language:en
Short-container-title:Composite Structures

Author:

Xu Yingjie,Ren Shixuan,Zhang Weihong

Funder

National Key Research and Development Program of China

Key Research and Development Program of Shaanxi Province

Shaanxi International Science and Technology Cooperation and Exchange Program

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Civil and Structural Engineering,Ceramics and Composites

Reference40 articles.

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2. Fabrication and erosion studies of C-SiC composite jet vanes in solid rocket motor exhaust;Kumar;J Eur Ceram Soc,2011

3. Microstructural finite-element modelling of a ceramic matrix composite to predict experimental measurements of its macro thermal properties;Sheikh;Modell Simul Mater Sci Eng,2001

4. Transverse thermal conductivity of thin C/SiC composites fabricated by slurry infiltration and pyrolysis;Berbon;J Am Ceram Soc,2001

5. Optimizing the transverse thermal conductivity of 2D-SiCf/SiC composites. II. Experimental;Youngblood;J Nucl Mater,2002

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