Numerical simulation of the effect of stitching on the delamination resistance of laminated composites subjected to low-velocity impact
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference41 articles.
1. Impact on composite structures;Abrate,1998
2. Effect of hybrid (micro- and nano-) fillers on impact response of GFRP composite;Koricho;Compos Struct,2015
3. Influence of fiber-matrix adhesion on mechanical properties of graphite/epoxy composites: II. Interlaminar fracture and inplane shear behavior;Deng;J Reinf Plast Compos,1999
4. The effect of interleaved composite nanofibrous mats on delamination behavior of polymeric composite materials;Saghafi;Compos Struct,2014
5. Improving impact resistance of carbon-fibre composites through interlaminar reinforcement;Walker;Compos A Appl Sci Manuf,2002
Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanical analysis of a stitched sandwich structure and its SiO2f/SiO2 panels: Experimental and numerical investigation on compression and shear performances;Composite Structures;2024-09
2. Inter-layer failure and toughening mechanisms of carbon/aramid hybrid fiber composites interleaved with micro/nano pulps under low-velocity impact load;Thin-Walled Structures;2024-09
3. Short beam shear performance of spread‐tow woven stitched composite with anti‐sandwich structure;Polymer Composites;2024-03-26
4. The thickness effect of rubbery nanofibrous mat on modes I–II fracture mechanism of composite laminates;Thin-Walled Structures;2024-03
5. Multi-scale numerical analysis of damage modes in 3D stitched composites;International Journal of Mechanical Sciences;2024-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3