Author:
Zhang Yan,Larsson Ragnar,Fan Jing-yu,Liu Johan
Subject
Computer Science Applications,Mechanical Engineering,General Materials Science,Modelling and Simulation,Civil and Structural Engineering
Reference19 articles.
1. Conductive adhesives for electronics packaging;Liu,1999
2. Fundamentals of microsystems packaging;Tummala,2001
3. Anisotropically conductive adhesive flip-chip bounding on rigid and flexible printed circuit substrates;Lai;IEEE Trans CPMT, Part B,1996
4. Effect of bump height on the reliability of ACA flip chip joining with FR4 rigid and polyimide flexible substrate;Lai;J Electron Manuf,1998
5. The effect of bump height on the reliability of ACF in flip-chip;Wu;Soldering Surface Mount Technol,2001
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