Predicting short beam shear strength reduction in carbon/epoxy laminates containing voids
Author:
Publisher
Elsevier BV
Subject
Civil and Structural Engineering,Ceramics and Composites
Reference49 articles.
1. Voids in fiber-reinforced polymer composites: a review on their formation, characteristics, and effects on mechanical performance;Mehdikhani;J Compos Mater,2019
2. Effects of pores and voids on the interlaminar delamination toughness of a carbon/epoxy composite;Asp;Proc 11th Int Conf Compos Mater Aust,1997
3. Microvoids in glass-resin composites their origin and effect;Bascom;I&EC Prod Res Dev,1968
4. Fatigue resistance of continuous glass fiber / polypropylene composites: consolidation dependence;Bureau;Compos Sci Technol,2004
5. The effect of voids on the flexural fatigue performance of unidirectional carbon fibre composites developed for wind turbine applications;Chambers;Int J Fatigue,2006
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Micro‐mesoscopic analysis of 3D void formation and evolution in CFRP composite using high‐resolution x‐ray microtomography;Polymer Composites;2024-02-13
2. Void formation and suppression in CFRP laminate using newly designed ultrasonic vibration assisted RTM technique;Composite Structures;2024-02
3. Effect of Resin-Missing Defects on Tensile Behavior of Carbon Fiber/Epoxy Composites;Polymers;2024-01-28
4. Uni- and Multi Variate Analysis of Short Beam Shear Strength of Composites Containing Voids;2024
5. Interfacial properties of carbon fiber‐reinforced biobased resin composites by single fiber fragmentation, fiber push‐out, and interlaminar shear strength;Polymer Composites;2023-12-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3